LEDinside, a green energy business unit of global market research firm TrendForce, said that the growth rate of China's LED packaging output in 2013 was much higher than the global average. Among them, lighting is still the largest field in China's LED packaging market in 2013, accounting for 42. The impact of the rapid growth of lighting market demand, the performance of China's lighting device packaging manufacturers represented by Mulinsen, Hongli Optoelectronics, and Changfang Lighting continued to flourish. The localization of high-quality chips has greatly improved the competitive position of China's LED lighting packaging industry. According to LEDinsdie data, in the Chinese chip market in 2013, the proportion of chips from local Chinese manufacturers has reached 80%.
Source:LEDinside
In the field of backlighting, LEDinside analyst Yu Bin said that with the support of Chinese TV and mobile phone brand manufacturers, mainland packaging manufacturers have gradually replaced Taiwan, Japan and South Korea manufacturers' existing market has become an irreversible trend. In the field of TV backlighting, the performances of Ruifeng Optoelectronics, Dongshan Precision, Zhaochi, and Yimeixinguang have all grown rapidly, and they have entered the supply chain of China's six major TV manufacturers. The experience of supplying branded manufacturers has significantly improved the quality control and management capabilities of China's LED packaging industry, and also accumulated the necessary strength for Chinese packaging companies to participate in global competition.
Emerging fields such as lights and FlashLEDs are expected to change with the market situation of international manufacturers. Chinese packaging manufacturers are actively infiltrating into the market of these emerging applications. In the case of lighting, backlighting, and display market competition, these emerging fields are expected to become the new hunting ground for Chinese packaging manufacturers in the future.
From the perspective of the global market, the main challenge for China's LED packaging manufacturers to increase their future is still from technology. In 2013, the industry saw emerging technologies such as EMC stent packaging, FlipChip, and wafer level packaging (CSP). Dehao Runda and Sanan Optoelectronics Flipchip technology have been successfully developed, and EMC bracket packaging has also attracted much attention. Tiandian, Simai, Hongli, Ruifeng, Jingke and other manufacturers have already introduced EMC packaging production lines. Although it is not yet possible to reshape the competitive landscape, the impact on the existing industry model is still worth noting. How these new materials and technologies will affect the existing industry in the next few years will still require time to verify.
Yu Bin believes that the evolution of LED packaging technology has always focused on the theme of terminal cost reduction. The use of new packaging materials, the formation of new packaging specifications, and the emergence of new packaging processes are all aimed at reducing the unit lumen cost under the premise of ensuring quality. In 2014, LEDinside expects global LED lighting product shipments to grow by 68, with an output value of $17.8 billion. In the backlight market penetration rate is saturated, other applications are on the rise, how China's LED packaging industry to grasp the opportunities of rapid development of the global lighting market, will become an important factor in determining the success or failure of enterprises.
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